Home > Products > Self Bonding Wire > Hot-melt Self-bonding Wire
Advantages: Hot-melt self-bonding wire offers a streamlined process as it bonds during the winding phase without the need for a separate bonding process. This can be cost-effective and is primarily used for wire diameters below 0.200 mm .
Application Fields: It is extensively used in applications requiring high-frequency tuning, interference suppression, and high saturation in inverter chokes. Also found in sensors, motor drive coils, RFID applications, magnetic locks, and audio and frequency isolation circuits .
Advantages: Hot-melt self-bonding wire offers a streamlined process as it bonds during the winding phase without the need for a separate bonding process. This can be cost-effective and is primarily used for wire diameters below 0.200 mm .
Application Fields: It is extensively used in applications requiring high-frequency tuning, interference suppression, and high saturation in inverter chokes. Also found in sensors, motor drive coils, RFID applications, magnetic locks, and audio and frequency isolation circuits .
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